Electronic module, methods of manufacturing and dr

专利名称：Electronic module, methods of

manufacturing and driving the same, andelectronic instrument

发明人：Takaaki Hayashi申请号：US11204123申请日：20050816公开号：US07327090B2公开日：20080205

专利附图：

摘要：An electronic module includes an EL section; a first substrate on which the ELsection is formed; a second substrate attached to the first substrate; an integrated circuit

chip mounted on the second substrate; a plurality of first power supply interconnectsformed on the first substrate, extending through a pair of regions located on both sidesof the EL section; and a plurality of second power supply interconnects formed on thesecond substrate, extending through a pair of regions located on both sides of theintegrated circuit chip.

申请人：Takaaki Hayashi

地址：Suwa JP

国籍：JP

代理机构：Oliff & Berridge, PLC

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