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Sensor device and ceramic package for mounting ele

2022-02-17 来源:我们爱旅游
专利内容由知识产权出版社提供

专利名称:Sensor device and ceramic package for

mounting electronic components

发明人:Jun Oonishi申请号:US10765882申请日:20040129公开号:US07116215B2公开日:20061003

专利附图:

摘要:A sensor device includes a G sensor producing an electric signal in accordancewith physical displacement of its sensing portion and a casing mounting this G sensor. Acasing chamber is sealed with a potting material so that the G sensor is covered with the

potting material. The potting material has the role of surely damping the high-frequencyvibration which generally causes resonance. Thus, the G sensor can accurately detect thecollision and vibration without being adversely influenced by the resonance.

申请人:Jun Oonishi

地址:Mizuho JP

国籍:JP

代理机构:Posz Law Group, PLC

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