专利名称:Sensor device and ceramic package for
mounting electronic components
发明人:Jun Oonishi申请号:US10765882申请日:20040129公开号:US07116215B2公开日:20061003
专利附图:
摘要:A sensor device includes a G sensor producing an electric signal in accordancewith physical displacement of its sensing portion and a casing mounting this G sensor. Acasing chamber is sealed with a potting material so that the G sensor is covered with the
potting material. The potting material has the role of surely damping the high-frequencyvibration which generally causes resonance. Thus, the G sensor can accurately detect thecollision and vibration without being adversely influenced by the resonance.
申请人:Jun Oonishi
地址:Mizuho JP
国籍:JP
代理机构:Posz Law Group, PLC
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