专利名称：System and method for lead frame package
degating
发明人：Sheila F. Chopin,Varughese Mathew申请号：US13950618申请日：20130725公开号：US09426884B2公开日：20160823
专利附图：
摘要：A method of forming an electronic component includes masking a lead frame toform a mask defining an exposed area, oxidizing the exposed area of the lead frame,wherein the mask inhibits oxidation of an unexposed area, and removing the mask from
the lead frame following oxidizing. A lead frame can include a metal sheet patterned todefine a pad region and leads. The metal sheet includes metal oxide in a select area. Thepad region is substantially free of metal oxide.
申请人：Sheila F. Chopin,Varughese Mathew
地址：Round Rock TX US,Austin TX US
国籍：US,US
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