专利名称：Solder paste and soldering method of the
same
发明人：Hidefumi Ueda申请号：US09604255申请日：20000627公开号：US06656291B1公开日：20031202
专利附图：
摘要：A solder paste including a solder powder; and a flux including at least anactivating agent, and acid anhydride obtained by a dehydration reaction of aliphaticcarboxylic acid having up to seven carbon atoms. The solder paste provides excellent
solderability, high corrosive resistance and a good shelf life, but not an offensive smell,during the soldering operation.
申请人：FUJITSU LIMITED
代理机构：Staas & Halsey LLP
更多信息请下载全文后查看
因篇幅问题不能全部显示，请点此查看更多更全内容