专利名称：PLASMA PROCESSING APPARATUS AND
CONTROL METHOD
发明人：Ryota SAKANE申请号：US15413631申请日：20170124
公开号：US20170213703A1公开日：20170727
专利附图：
摘要：The plasma processing apparatus includes a first electrode to which highfrequency power is applied, a second electrode that functions as a counter electrodewith respect to the first electrode, and a controller configured to control distribution of
plasma generated between the first electrode and the second electrode. The firstelectrode is, for example, an upper electrode. The second electrode includes a lowerelectrode, and a peripheral portion disposed around the lower electrode. The peripheralportion includes a plurality of split electrodes divided in a peripheral direction. For eachsplit electrode, the controller controls an impedance between the plasma and a groundvia the split electrode.
申请人：TOKYO ELECTRON LIMITED
地址：Tokyo JP
国籍：JP
更多信息请下载全文后查看
因篇幅问题不能全部显示，请点此查看更多更全内容