CG0402MLE-18G,CG0603MLE-18E, 规格书,Datasheet 资料

MPLIANTFeatures■ 0402 and 0603 package options■ Rated for IEC 61000-4-2, for applications requiring up to 18 V DC■ Withstands multiple ESD strikes■ Low capacitance and leakage currents for invisible load protection■ Tape and reel packaging*RoHS CO Description ChipGuard® MLE Series Varistor ESD Clamp ProtectorsThe ChipGuard® CG0402MLE and CG0603MLE Series have been designed to provide high frequency attenuation, thereby providing suppression and fi ltering in a single device. The MLE family also offers protection to ESD standards such as IEC61000-4-2 for applications requiring up to 18 V DC and is available in the industry standard 0603 and 0402 type leadless surface mount packaging.

Electrical Characteristics @ 25 °C (unless otherwise noted)

ContinuousOperating VoltageVrms(V)Max.

Typ.

VDC (V)

Max.

Clamping VoltageVCLAMP (V)Typ.1 A@ 8/20 µs

CG0402MLE-18GCG0603MLE-18E

8.58.5

1212

1818

10060

3.5 V0.30.3

5.5 V0.40.4

Off-state Current

IL(µA) Max.9 V0.50.5

12 V11

18 V1010

Capacitance

CP(pF)Max.1 Vrms@ 1 MHz

950

Model

Environmental CharacteristicsOperating Temperature ..-55 °C to +125 °CStorage Temperature ......-55 °C to +125 °CResponse Time ..................................<1 nsStandard .................IEC 61000-4-2 Level 4These products are RoHS compliant. There is some lead contained within the glass of the ceramic. This is acceptable under exemption no. 5 of the RoHS directive (DIRECTIVE 2002/95/EC OF THE EUROPEAN PARLIAMENT AND OF THE COUNCIL of 27 January 2003 on the restriction of the use of certain hazardous substances in electrical and electronic equipment).

Surge Withstand Ratings

Peak Current 8/20 µs(Max.)

15 A20 A

Peak Current

@ 8 kV(Max.)

30 A45 A

Model

CG0402MLE-18GCG0603MLE-18E

Voltage-Current Characteristics

102

CG0402MLE-18GCG0603MLE-18ECG0402MLE-18GSchematic

Voltage (Volts)CG0603MLE-18E101

100

10-810-710-610-510-410-310-210-1100101102103104

SOURCE = DCSOURCE = 8/20 µs PULSE, IPEAK*RoHS Directive 2002/95/EC Jan 27, 2003 including Annex. Specifi cations are subject to change without notice.

Customers should verify actual device performance in their specifi c applications.

I Current (Amps)

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Product Dimensions

ARecommended Pad Layout

AW MM

DIMENSIONS:

(INCHES)

BLCDB Dimension L W A B CG0402MLE Series 1.00 ± 0.15 (0.04 ± 0.006) 0.50 ± 0.10 (0.02 ± 0.004) 0.50 ± 0.10 (0.02 ± 0.004) 0.25 ± 0.15 (0.10 ± 0.006) CG0603MLESeries1.60 ± 0.20(0.064 ± 0.008)0.80 ± 0.20(0.032 ± 0.008)0.80 ± 0.20(0.032 ± 0.008)0.30 ± 0.20(0.012 ± 0.008) Dim. CG0402MLE CG0603MLESeries Series A 0.51 0.76 (0.020) (0.030) B 0.61 1.02 (0.024) (0.040) C 0.51 0.50 (0.020) (0.020) D 1.70 2.54 (0.067) (0.100)Solder Refl ow Recommendations300250200150100500110 sec. (min.)30-70sec.Time (seconds)

120 sec. (min.)Preheat Stages 1-3SolderingCooling A Stage 1 Preheat B Stage 2 Preheat C Stage 3 Preheat D Main Heating Ambient to Preheating Temperature140 °C to 160 °C Preheat to 200 °C 200 °C 210 °C 220 °C 230 °C 240 °C 200 °C to 100 °C 30 s to 60 s60 s to 120 s20 s to 40 s60 s to 70 s55 s to 65 s50 s to 60 s40 s to 50 s30 s to 40 s1 °C/s to 4 °C/sTemperature (°C) E Cooling • • • • This product can be damaged by rapid heating, cooling or localized heating.Heat shocks should be avoided. Preheating and gradual cooling recommended.

Excessive solder can damage the device. Print solder thickness of 150 to 200 um recommended.

Solder gun tip temperature should be kept below 280 °C and should not touch the device directly. Contact should be less than 3 seconds. A solder gun under 30 watts is recommended.

How to Order

CG 0402 MLE - 18 G

ChipGuard® Product DesignatorPackage Option

0402 = 0402 Package 0603 = 0603 PackageMultilayer Series DesignatorOperating Voltage 18 = 18 V

Tape & Reel Packaging

E = 4,000 pcs. per reel (0603 package) G = 10,000 pcs. per reel (0402 package)Ni barrier terminations are standard on all ChipGuard® part numbers.

Specifi cations are subject to change without notice.

Customers should verify actual device performance in their specifi c applications.

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Packaging Dimensions

13.0 ± 1.0(0.52 ± 0.04)8.00 ± 0.30(0.32 ± 0.012)4.00 ± 0.10(0.16 ± 0.004)C1.50 ± 0.10(0.06 ± 0.004)2.0 ± 0.50(0.08 ± 0.02)62.0 ± 1.50(2.48 ± 0.06)13.0 ± 0.50(0.52 ± 0.02)LTOPTAPEWGD3.50 ± 0.05(0.14 ± 0.002)21.0 ± 0.80(0.84 ± 0.032)180.8 ± 2.0(7.12 ± 0.08)NOTES:TAPE MATERIAL IS PAPER.

0.48 ± 0.03

TAPE THICKNESS IS

(0.019 ± 0.0012)

COVER TAPE ADHESION IS 40 ± 15 GRAMS.

MMDIMENSIONS:

(INCHES)9.0 ± 0.50(0.36 ± 0.02) Dimension

C D L W G

CG0402MLE Series 1.75 ± 0.05 (0.04 ± 0.002) 2.00 ± 0.02 (0.08 ± 0.0008) 1.19 ± 0.05 (0.047 ± 0.002) 0.69 ± 0.05 (0.027 ± 0.002) 2.0 ± 0.05 (0.08 ± 0.002)

CG0603MLESeries1.75 ± 0.10(0.04 ± 0.004)2.00 ± 0.05(0.08 ± 0.002)1.80 ± 0.20(0.072 ± 0.008)0.90 ± 0.20(0.036 ± 0.008)4.0 ± 0.05 (0.16 ± 0.002)

Asia-Pacifi c: Tel: +886-2 2562-4117 • Fax: +886-2 2562-4116Europe: Tel: +41-41 768 5555 • Fax: +41-41 768 5510

The Americas: Tel: +1-951 781-5500 • Fax: +1-951 781-5700www.bourns.com

REV. H 11/10

Specifi cations are subject to change without notice.

Customers should verify actual device performance in their specifi c applications.

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