专利名称：Enhanced design and process for a
conductive adhesive
发明人：Donald Seton Farquhar,Gerard Paul
Kohut,Andrew Michael Seman,MichaelJoseph Klodowski
申请号：US08864044申请日：19970528公开号：US06534724B1公开日：20030318
专利附图：
摘要：The present invention provides a new device and method for enhancing the
electrical properties of the thick metal backer/electrically conductive thermosetadhesive/printed circuit board or card assembly. The enhanced electrical properties areobtained by providing a thin bondline of conductive adhesive that is essentially void free.
申请人：INTERNATIONAL BUSINESS MACHINES CORPORATION
代理人：William N. Hogg
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