专利名称：Head assembly
发明人：Henze, Richard H.,Jeans, Albert H.,Poorman,
Paul W.
申请号：EP01306098.3申请日：20010716公开号：EP1184843A2公开日：20020306
专利附图：
摘要：A method of forming a head assembly (30) includes providing a base member(34); forming a plurality of head components (60) upon the base member (34) individuallyadapted to communicate information relative to a tape; providing a plurality of
component regions (46) adjacent respective ones of the head components (60) and apath of travel of the tape; and providing a support region (48) intermediate adjacentones of the head components (60) and positioned to support the tape moving along thepath of travel, the support region (48) comprising a material different than a material ofthe component regions (46).
申请人：Hewlett-Packard Company
地址：3000 Hanover Street Palo Alto, CA 94304 US
国籍：US
代理机构：Jehan, Robert
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