专利名称:Manufactoring method of an
electromagnetically sealed support of twometallic components and a shielded circuitboard with such components
发明人:BEHRENS, RALF, DIPL.-ING. (FH),MEIER,
NORBERT, DIPL.-ING.,SCHAFFER, KURT-MICHAEL
申请号:EP93108782.9申请日:19930601公开号:EP0627876B1公开日:19960228
摘要:The first component (S1, S2, S3) has a groove (N) on its top (OS). This groove (N)is preferably located on the edge of the top (OS) and is preferably covered by a laminate(L) as an extension of the top. The second component (B1, B2, B3, B4) has a blade-likeinsertion region (EB). In the case of a first configuration of the invention, stamped studs(P1) in the region of the laminate (L) are introduced into the surface (OS) of the firstcomponent (S1, S2, S3) after insertion of the insertion region (EB) of the secondcomponent (B1, B2, B3) into the groove (N) (Fig. 1a-4b). In the case of a second
embodiment of the invention, the stamped studs (P2) are introduced into the blade-likeinsertion region (EB) of the second component. The two components (S1, B4) are thenfixed, after the insertion region (EB) of the second component (B4) has been inserted intothe groove (N) in the first component (S1), by peening the stamped studs (P2) in theinterior of the groove (N) (Fig. 5a, 5b).
申请人:SIEMENS AKTIENGESELLSCHAFT,SIEMENS AG,SIEMENS AKTIENGESELLSCHAFT
地址:DE
国籍:DE
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