专利名称：METHODS OF FORMING ELECTRONIC
PACKAGES
发明人：KECK, Steven, David,ROCAZELLA, Michael,
Angelo,ENGELGAU, Peter, Michael,HANNON,Gregory, Eugene,WHITE, Danny,Ray,NAGELBERG, Alan, Scott
申请号：EP91907909.0申请日：19910225公开号：EP0516765A1公开日：19921209
摘要： Forming a macrocomposite body useful as electronic package or enclosure byinfiltrating spontaneously a permeable mass of a filler (247) or a preform with a matrixmetal in the molten state (250) and bonding the spontaneously infiltrated material atleast one second material such as a ceramic or a body containing a ceramic and / or ametal or metal containing body. In addition, prior to infiltration, it puts the filler materialor the preform in contact with at least a portion of a second material such that afterinfiltration of the filler material or the preform by the matrix metal in the form melted,the infiltrated material is bonded to the second material, forming a macrocompositebody. You can then coat the body macrocomposite by techniques described to improveits performance and / or its binding capacity.
申请人：LANXIDE TECHNOLOGY COMPANY, LP
地址：1300 Marrows Road, P.O.Box 6077 Newark, DE 19714-6077 US
国籍：US
代理机构：Schmitz, Jean-Marie, et al
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