专利名称：MULTICHIP MODULE AND INTEGRATED
CIRCUIT SUBSTRATES HAVING PLANARIZEDPATTERNED SURFACES
发明人：CECH, Jay, Martin,BURNETT, Andrew, Frank申请号：EP92907235.0申请日：19920210公开号：EP0571547A1公开日：19931201
摘要： Describes a method of filling profiles for a susbtrat to create a planar surfacepattern on said susbtrat. The method comprises the steps of: creating a susbtrat (2)provided with a profile pattern (4) defined by a dielectric material (6); depositing on thelatter, a layer of conductive material (12) including first portions (8) covering the dielectricmaterial, the second parts (10) completes said profiles, and side wall portions (12)connecting the first and second portions; coating the substrate with a photoresist (16)and applying thereto a similar pattern to said pattern profiles; removing by etching allportions of the conductive layer, with the exception of the second parts that fulfill theprofiles, so as to inhibit any undercutting of the wall portions of the conductive layer; andremoving the varnish so as to obtain a substrate having a substantially planar patternedsurface. Also described are multichip modules and integrated circuits planar.
申请人：THE BOEING COMPANY
地址：7755 East Marginal Way South, P.O. Box 3999 Seattle, Washington 98124-2499US
国籍：US
代理机构：Baillie, Iain Cameron
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